Date: 5 Dec 2019 (Thursday)
Time: 09:30-17:00
Venue: CKK Auditorium, Hong Kong Science Park
Organiser: HKSTP & UMEC
Co-organiser: CUHK, HKU, HKUST, IEEE EDS
Supporting organiser: HKSAIR, HKAI LAB, NeuHelium
由香港科技园和联合微电子中心联合主办的 HKSTP Thought-leadership Series：2019 AI 芯片峰会将讨论与 AI 芯片开发相关的各种主题，包括设计工具的最新发展与异质结构整合技术的趋势，以及市场的未来方向。
日期: 2019 年 12 月 5 日（星期四）
时间: 09:30-17:00
地点: 香港科学园CKK高锟会议中心 (金蛋)
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活动背景
Looking forward the 5G, V2X and Smart City, AI architecture will be blooming not only the upstream cloud computing, but also midstream edge computing. The edge computing AI chips need to be more boosted by upgrading chip design architecture and changing the transistor technology in the front end.
展望5G、车联网和智能城市，人工智能架构不仅在上游云计算领域，也在中游的边缘计算领域中蓬勃发展。边缘计算的人工智能芯片需要通过升级芯片设计架构和改变前端的晶体管技术，来得到更大的发展。
To address market needs, system packages through heterogeneous integration has taken the driver’s seat and propel system performances toward smart computing, wide data bandwidth, small form factor, with low or zero latency and energy efficiency. And all these are capped by ever better system cost per function as technology and product migrate from generation to generation.
为了满足市场需求，通过异构集成的系统占据了主导地位，且推动系统性能朝着智能计算、更宽的数据带宽、小型化设计、低/零延迟和能效的方向发展。随着技术和产品一代又一代的迁移，所有这些性能的分项系统成本都将更容易被同时涵盖。
Facing the enormous challenges of high design complexity and tight time-to-market, advances design tools (i.e., EDA tools) are critical for timely and competitive design of AI chips. The morning section will introduce novel machine learning based design methodologies and supporting tools to aid and facilitate the design and verification of AI chips and accelerators.
面对设计复杂度高和市场时间紧凑的巨大挑战，先进的设计工具（即EDA工具）对于AI芯片的及时性及具竞争力的设计至关重要。早上议程将介绍新的基于机器学习的设计方法和协助工具，以帮助及促进人工智能芯片和加速器的设计及验证。
AI Chips and Systems Workshop, once again gathering top researchers and bright minds to share their treasure experiences on future technology development roadmap, challenges, and effective solutions.
本次人工智能芯片和系统研讨会，将再次聚集各界顶尖的研究人员和杰出的人才，分享他们对未来技术发展的远景、挑战和有效解决方案的宝贵经验。
Dec. 5th, 2019 (Thursday)
Programme Rundown
Time | Rundown |
09:00-09:30 | Registration |
Morning Section : AI-Assisted Design Tool for AI Hardware 人工智能硬件辅助设计工具 | |
09:30-09:35 | Opening Remarks - Hong Kong Science and Technology Parks Corporation (HKSTP) |
09:35-09:40 | Opening Remarks - United Microelectronics Centre (UMEC) |
09:40-09:45 | Photo-taking |
09:50-10:15 | Keynote 1: How does new IC design approach enable AI applications? 新的集成电路设计方法如何实现人工智能应用？ Dr. Walden Rhines, CEO Emeritus, Mentor |
10:20-10:45 | Keynote 2: Computing with Heterogeneous Hardware Systems for the AI Revolution 面向人工智能革命的异构硬件系统计算 Prof. Deming Chen, University of Illinois Urbana-Champaign |
10:50-11:15 | Keynote 3: AI in Physical Design Tools 物理设计工具中的人工智能 Prof. Evangeline Young, Professor, Department of Computer Science and Engineering, CUHK |
11:15-11:30 | Coffee Break |
11:30-11:55 | Keynote 4: Machine Learning for Chip, Package and Board Design 机器学习应用于芯片, 封装与电路板设计 Prof. Elyse Rosenbaum, University of Illinois Urbana-Champaign |
11:55-12:35 | Panel Discussion: New EDA tools ? Beyond traditional EDA what is a chance for start-ups 新的EDA工具？与传统的EDA相比, 新创企业的机会在哪? Moderator: Dr. Mei Kei Ieong, CEO, UMEC(HK) Panel Members: Dr. Walden Rhines, CEO Emeritus, Mentor Charlie Huang, Former SVP Cadence (TBC) Prof. Deming Chen, University of Illinois Urbana-Champaign Prof. Martin Wong, Dean of Engineering, CUHK |
12:35 | VIP Lunch @ ClubONe HKSTP |
Afternoon Section: Heterogeneous System Integration & Hardware-Aware Design Algorithms | |
14:00-14:20 | AI Chips Centre and Emerging Smart System (ACCESS) overview 人工智能芯片中心与新兴智能系统（ACCESS）介绍 Prof. Tim Cheng, Dean of Engineering, |
14:20-14:40 | Keynote 5: Efficient Reconfigurable Hardware for AI 面向人工智能的高效可重构硬件 Dr. Hayden So, Department of Electrical and Electronic Engineering, The University of Hong Kong |
14:40-15:00 | Keynote 6: Energy efficient AI accelerators for sensor-based edge devices 用于传感器边缘设备的节能人工智能加速器 Prof. Chi Ying Tsui, Professor, Department of Electrical and Electronic Engineering |
15:00-15:20 | Coffee Break |
15:20-15:40 | Keynote 7: The Challenge and Opportunity of Heterogeneous System Integration 异构系统集成的挑战与机遇 Mr. Nelson Fan, VP, APT Business Development, ASM Pacific Technology |
15:40-16:00 | Keynote 8: Discontinuities Drive 3DIC & Chip Integration 不连续性驱动3DIC和芯片集成 Dr. Walden Rhines, CEO Emeritus, Mentor |
16:00-16:40 | Panel Discussion: What’s kind of microelectronics infrastructure is needed in Hong Kong ? 香港需要什么样的微电子基础设施？ Moderator: Dr. Mei Kei Ieong, CEO, UMEC(HK) Panel Members: Mr. Nelson Fan, VP, APT Business Development, ASM Pacific Technology Prof. Tim Cheng, Dean of Engineering, |
16:40-16:45 | Closing Remarks Dr. Mei Kei Ieong, CEO, UMEC(HK) |
16:50 | End of Programme |
Dec. 6th, 2019 (Friday)
Programme (by invitation only)
Program | Remark |
SenseTime | The world’s leading artificial intelligence platform company valued above USD 4.5 billion. |
A.I.R – RCC (Artificial Intelligence and Robotics – Robotics Catalysing Centre) | HKSTP newest facility integrating infrastructure, technical support and knowledge exchange for AI and robotics communities |
UMEC (HK)Ltd. | An innovative research & development centre to develop next-generation artificial intelligence chips and 5G applications |
Collaboration discussion | Topic: (1) 3D IC (2) ACCESS (AI Chips Centre and Emerging Smart System) |
End of the programme |
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